EN 60749-39 : 2006

Superseded

View Superseded by

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 39: MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED FOR SEMICONDUCTOR COMPONENTS

Superseded date

28-01-2022

Published date

12-01-2013

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Apparatus
3 Samples
4 Procedure
  4.1 Sample preparation
  4.2 Absorption measurements below 100 degree C
  4.3 Solubility and diffusivity calculation
  4.4 Desorption measurements above 100 degree C
5 Calculation of activation energy for moisture diffusion
6 Summary

Describes the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.

Committee	SR 47
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Superseded
SupersededBy	EN IEC 60749-39:2022

Standards	Relationship
NBN EN 60749-39 : 2007	Identical
BS EN 60749-39:2006	Identical
CEI EN 60749-39 : 2007	Identical
NEN EN IEC 60749-39 : 2007	Identical
NF EN 60749-39 : 2006	Identical
I.S. EN 60749-39:2006	Identical
UNE-EN 60749-39:2006	Identical
PN EN 60749-39 : 2008	Identical
IEC 60749-39:2006	Identical
DIN EN 60749-39:2007-01	Identical

EN 60749-20-1 : 2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
BS EN 60749-20-1:2009	Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
I.S. EN 60749-20-1:2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT