Name: EN ISO 9455-14:2017
Brand: CEN

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)

Published date

20-09-2017

Publisher

Comite Europeen de Normalisation

European foreword
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Reagents and materials
6 Apparatus
7 Test pieces
8 Procedure
9 Examination of the test piece
10 Expression of results
11 Test report

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Committee	CEN/TC 121
DevelopmentNote	Supersedes EN 29455-14. (10/2017)
DocumentType	Standard
PublisherName	Comite Europeen de Normalisation
Status	Current
Supersedes	EN 29455-14:1993

Standards	Relationship
DIN EN ISO 9455-14:2017-12	Identical
NS EN ISO 9455-14 : 2017	Identical
NEN EN ISO 9455-14 : 2017	Identical
DIN EN ISO 9455-14 E : 2017	Identical
UNI EN ISO 9455-14 : 2017	Identical
NF EN ISO 9455-14 : 2017	Identical
ONORM EN ISO 9455-14 : 2017	Identical
I.S. EN ISO 9455-14:2017	Identical
SN EN ISO 9455-14 : 2018	Identical
PN EN ISO 9455-14 : 2017	Identical
BS EN ISO 9455-14:2017	Identical
ISO 9455-14:2017	Identical
UNE-EN ISO 9455-14:2018	Identical
DIN EN ISO 9455-14:2016-09 (Draft)	Identical

ISO 197-1:1983	Copper and copper alloys Terms and definitions Part 1: Materials
ISO 9455-2:1993	Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
ISO 9455-1:1990	Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
ISO 9453:2014	Soft solder alloys Chemical compositions and forms