I.S. EN 60191-6-4:2003
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
4.1 Ball grid array package (BGA) Type 1 - Ball datum
4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
5.1 Datum S pertaining to ball coplanarity
5.2 Datum A, B
5.3 Definition of specified dimensions and measuring
method
5.4 Profile of a package edge surface v
5.5 Mounting height A
5.6 First stand-off A1
5.7 Second stand-off A4
5.8 Ball diameter b
5.9 Ball center position X
5.10 Ball coplanarity y
5.11 Package top flatness y1
Annex ZA: Normative references to international publications
with their corresponding European publications
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