• There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

I.S. EN IEC 61188-6-1:2021

Current

Current

The latest, up-to-date edition.

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

28-04-2021

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Design requirements
5 Component classification
6 The proportional dimensioning system
7 Terminal classification
8 Requirements for lands of solder joints
Annex A (informative) Dimensioning concept of former IEC 61188-5-1
Annex B (informative) History of land dimensioning standards
Bibliography

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards.

Committee
TC 91
DocumentType
Standard
ISBN
978-2-8322-9443-7
Pages
78
ProductNote
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document. THIS STANDARD ALSO REFERS TO IPC-SM-782
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
EN IEC 61188-6-1:2021 Identical
IEC 61188-6-1:2021 Identical

View more information
£54.00
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.