I.S. EN IEC 61760-3:2021
Current
The latest, up-to-date edition.
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021)
Hardcopy , PDF
English
30-03-2021
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements to component design and component specifications
5 Typical process conditions for THR soldering process
6 Relevant tests and requirements for components and component specifications for THR soldering process
7 Quality criteria for THR soldering
Annex A (informative) Flux creeping-up and solder wicking
Bibliography
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