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IEC 61189-3:1997+AMD1:1999 CSV

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

12-09-2022

Language(s)

English - French

Published date

27-11-2006

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment inaddition to this publication.

Committee
TC 91
DocumentType
Standard
Pages
141
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

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£646.23
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