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IEC 61191-3:1998

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

12-09-2022

Language(s)

English - French

Published date

28-08-1998

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Committee
TC 91
DocumentType
Standard
Pages
31
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
UNE-EN 61191-3:1998 Identical

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£75.05
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