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IEC
IEC 62047-18:2013

IEC 62047-18:2013

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

17-07-2013

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test
        piece/substrate interface
Annex B (informative) - Precautions necessary
        for the force displacement relationship

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Committee
TC 47/SC 47F
DevelopmentNote
Stability date: 2017. (07/2013)
DocumentType
Standard
Pages
26
PublisherName
International Electrotechnical Committee
Status
Current

IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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