Customer Support: +44 (0)203 327 3140

Login to i2i Subscription Intertek.com
  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Go to AMERICAS site
Dismiss alert
Please enter a keyword to search
Advanced search
Home
IEC
IEC 62047-9:2011

IEC 62047-9:2011

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Amended by

IEC 62047-9:2011/COR1:2012

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

13-07-2011

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Measurement methods
Annex A (informative) - Example of bonding force
Annex B (informative) - An example of the fabrication
        process for three-point bending specimens
Bibliography

IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters. The contents of the corrigendum of March 2012 have been included in this copy.

DevelopmentNote
Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
49
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NF EN 62047-9 : 2012 Identical
NBN EN 62047-9 : 2011 Identical
NEN EN IEC 62047-9 : 2011 Identical
I.S. EN 62047-9:2011 Identical
PN EN 62047-9 : 2012 Identical
UNE-EN 62047-9:2011 Identical
BS EN 62047-9:2011 Identical
CEI EN 62047-9 : 2012 Identical
EN 62047-9:2011 Identical
DIN EN 62047-9:2012-03 Identical

BS EN 62047-15:2015 Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
17/30352696 DC : DRAFT SEP 2017 BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS
I.S. EN 62047-15:2015 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS
CEI EN 62047-15 : 2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS
IEC 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
14/30296140 DC : 0 BS EN 62047-25 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON-BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
14/30217668 DC : 0 BS EN 62047-15 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS
EN 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

IEC 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
ISO 6892-1:2016 Metallic materials Tensile testing Part 1: Method of test at room temperature
IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
ASTM E 8M : 2004 Standard Test Methods for Tension Testing of Metallic Materials [Metric] (Withdrawn 2008)
IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
IEC 60749-19:2003+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

View more information
£140.48
Excluding VAT
GBP
CAD
CHF
CNY
DKK
EUR
GBP
HKD
IDR
INR
JPY
KRW
MXN
NOK
NZD
SEK
SGD
USD
ZAR
Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

or

Get in touch with us