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IEC PAS 62326-7-1:2007

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Performance guide for single- and double-sided flexible printed wiring boards

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English

Published date

26-04-2007

1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
5 Performance levels
6 Base materials
7 Visual inspection
   7.1 Test environment
   7.2 Test specimens
   7.3 Tools for testing
   7.4 Preparation of limit samples
   7.5 Description of inspection
8 Dimensional inspections
   8.1 Measurement of dimension
   8.2 External dimension
   8.3 Thickness
   8.4 Hole diameter
   8.5 Conductor width
   8.6 Cumulative pattern pitch
   8.7 Distance between hole centers
   8.8 Design minimum distance between board edge and
        conductor
   8.9 Position accuracy
   8.10 Registration of pressure sensitive or heatactivated
        adhesive (Including adhesive squeeze-out) to flexible
        printed board and stiffener
9 Electrical performance test
10 Mechanical performance test
11 Environmental performance
12 Chemical resistance
13 Cleanliness
14 Flame resistance
15 Marking, packaging, and storage
   15.1 Marking on products
   15.2 Marking on package
   15.3 Packaging and storage
Annex A - Handling instruction manual handling of
          polyimide-base FPC
Annex B - Ion migration test
Annex C - Whisker test
Annex D - Additional information - Explanation on JPCA
          performance guide for single-and double-sided
          flexible printed wiring boards

Provides the requirements for the single- and double-sided flexible printed wiring boards (hereinafter designated as "flexible printed board" or FPC)

DevelopmentNote
Stability Date: 2013. (10/2012)
DocumentType
Miscellaneous Product
Pages
41
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
DD IEC/PAS 62326-7-1:2007 Identical
NEN NPR IEC/PAS 62326-7-1 : 2007 Identical

BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)

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