IPC-9701B:2022
Current
Current
The latest, up-to-date edition.
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Available format(s)
Hardcopy
Language(s)
English
Published date
01-02-2022
Publisher
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies.
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