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IPC
IPC D 949 : 1987

IPC D 949 : 1987

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,

Superseded date

31-12-1991

Published date

12-01-2013

Publisher

Institute of Printed Circuits

Covers the requirements and considerations for the design of rigid multilayer printed boards based on industry manufacturing capabilities. Purpose is to establish rules, principles, and other considerations for mechanical, electrical, and producibility properties which the designer can use to select design features, and properties that will result in a multilayer board that will meet performance and cost requirements.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC S 815 : B1987 GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS
IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC D 354 : 0 LIBRARY FORMAT DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
IPC D 351 : 0 PRINTED BOARD DRAWINGS IN DIGITAL FORM
IPC D 330 : 1992 DESIGN GUIDE MANUAL
IPC D 352 : 0 ELECTRONIC DESIGN DATA DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM
IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC D 300 : G1984 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC D 422 : 0 DESIGN GUIDE FOR PRESS FIT RIGID PRINTED BOARD BACK PLANES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC L 108 : B SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS
IPC L 115 : B SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
IPC D 322 : 0 GUIDELINES FOR SELECTING PRINTED WIRING BOARD SIZES USING STANDARD PANEL SIZES
QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
MIL-C-14550 Revision B:1983 COPPER PLATING (ELECTRODEPOSITED)
MIL-P-81728 Revision A:1973 PLATING, TIN LEAD, (ELECTRODEPOSITED)
IPC L 109 : B SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS
IPC CF 150 : E COPPER FOIL FOR PRINTED WIRING APPLICATIONS
IPC D 350 : 0 PRINTED BOARD DESCRIPTION IN DIGITAL FORM
IPC AM 361 : 1982 PRINTED BOARDS, SPECIFICATION FOR RIGID SUBSTRATES FOR ADDITIVE PROCESS,
IPC AM 372 : 1978 ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS,
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
QQ-N-290 Revision A:1971 NICKEL PLATING (ELECTRODEPOSITED)
IPC ML 950 : C1980 RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
IPC R 700 : C1988 SUGGESTED GUIDELINES FOR MODIFICATION, REWORK AND REPAIR OF PRINTED BOARDS AND ASSEMBLIES

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