IPC MC 324 : 1988

Establishes the qualification and performance requirements for a metal core packaging interconnection (P/I) structure, hereafter referred to as a metal core board. Metal core boards consist of at least one conductive pattern on each side of an insulated metal substrate. Interconnection between conductive patterns shall be made using plated-through holes. The metal substrate shall be an integral part of the metal core board prior to interconnecting the conductive pattern. The following specific topics are covered: product classifications; metal core board types; metal core insulating methods.