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IPC QE 605 : A

Current

Current

The latest, up-to-date edition.

PRINTED BOARD QUALITY EVALUATION HANDBOOK

Published date

01-02-1999

Sections
A Drilling and hole cleaning
B Plated-through hole characteristics
C Plating conditions
D Laminate imperfections
E Multilayer lamination
F Surface conductor & land conditions
G Edge contacts
H Solderability
J Solder mask
K Miscellaneous

Contains photographic illustrations of various anomalies and characteristics of printed wiring boards that can be used to identify those anomalies that are sometimes seen during inspection and evaluation processes.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC MS 810 : 0 GUIDELINES FOR HIGH VOLUME MICROSECTION
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS

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