JIS C 60068-2-58:2002

Name: JIS C 60068-2-58:2002
Brand: JSA

Superseded

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Environmental testing Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Available format(s)

Hardcopy , PDF

Superseded date

29-07-2010

Language(s)

English

Published date

01-01-2003

Publisher

Japanese Standards Association

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This Standard outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in JIS C 0050 and JIS C 0053, for which guidance is given in IEC 60068-2-44. This Standard provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD). The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.

DocumentType	Standard
Pages	21
PublisherName	Japanese Standards Association
Status	Superseded
SupersededBy	JIS C 60068-2-58:2006

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JIS C 60068-2-58:2002

Environmental testing Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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Abstract

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