Copper foil for printed wiring boards

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

30-11-1998

Publisher

Japanese Standards Association

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This specification gives requirements for properties of copper toil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.

DocumentType	Standard
Pages	21
PublisherName	Japanese Standards Association
Status	Current
Supersedes	JIS C 6511:1992 JIS C 6512:1992 JIS C 6513:1996

Standards	Relationship
IEC 61249-5-1:1995	Identical

Reaffirmed 2014 1998(R2014) [20/10/2014]1998(R2009) [01/10/2009]1998 [20/10/1998]

JIS C 6489:1999	Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6488:1999	Base materials for printed circuits - Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
JIS C 6493:1999	Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
JIS C 6494:1999	Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
JIS C 6485:2008	Base materials for printed circuits - Paper base, phenolic resin
JIS C 6484:2005	Base materials for printed circuits - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)

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JIS C 6515:1998

Copper foil for printed wiring boards

Table of Contents

Abstract

General Product Information

International Equivalents

History

Standards Referencing This Book

Category

Subcategory