Name: NBN EN 60749-25 : 2004
Brand: NBN

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

Published date

12-01-2013

Publisher

Belgian Standards

1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

DocumentType	Standard
PublisherName	Belgian Standards
Status	Current

Standards	Relationship
DIN EN 60749-25:2004-04	Identical
BS EN 60749-25:2003	Identical
UNE-EN 60749-25:2004	Identical
I.S. EN 60749-25:2003	Identical
EN 60749-25:2003	Identical

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NBN EN 60749-25 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

Table of Contents

Abstract

General Product Information

International Equivalents

Category

Subcategory