NEN EN IEC 61190-1-2 : 2014
Current
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
Published date
12-01-2013
Publisher
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
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