NEN NPR CLC IEC/TR 62258-3 : 2007
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
Published date
12-01-2013
Publisher
Provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.
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