• There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

NF EN 61189-6 : 2008

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES

Published date

12-01-2013

INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's "t" distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
   8.1 Test 6C01: Determination of acid value of liquid
        soldering flux - potentiometric and visual titration
        methods
   8.2 Test 6C02: Determination of halides in fluxes,
        silver chromate method
   8.3 Test 6C03: Solids content, flux
   8.4 Test 6C04: Quantitative determination of halide
        content in fluxes (chloride and bromide)
   8.5 Test 6C05: Qualitative analysis of fluorides and
        fluxes by spot test
   8.6 Test 6C06: Quantitative determination of fluoride
        concentration in fluxes
   8.7 Test 6C07: Acid number of rosin
   8.8 Test 6C08: Specific gravity
   8.9 Test 6C09: Determination of the percentage of flux on/in
        flux-coated and/or flux-cored solder
   8.10 Test 6C10: Flux induced corrosion (copper mirror method)
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
   12.1 Test 6X01: Determination of solder powder particle
        size distribution - Screen method for types 1-4
   12.2 Test 6X02: Solder powder particle size
        distribution-measuring microscope method
   12.3 Test 6X03: Solder powder particle size distribution -
        Optical image analyzer method
   12.4 Test 6X04: Solder powder particle size distribution -
        Measuring laser diffraction method
   12.5 Test 6X05: Determination of maximum solder powder
        particle size
   12.6 Test 6X06: Solder paste metal content by weight
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

DevelopmentNote
Indice de classement: C93-736. PR NF EN 61189-6 April 2004. (04/2004)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Current

Standards Relationship
DIN EN 61189-6:2007-03 Identical
I.S. EN 61189-6:2006 Identical
IEC 61189-6:2006 Identical
EN 61189-6:2006 Identical
SN EN 61189-6 : 2006 Identical
BS EN 61189-6:2006 Identical

NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.