OVE EN 60191-4:2019
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013/A1:2018)
Available format(s)
Hardcopy
Language(s)
English
Published date
07-03-2019
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
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