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IEC 61163-2:1998

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Reliability stress screening - Part 2: Electronic components

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

12-31-2021

Language(s)

English - French, Spanish, Castilian

Published date

11-27-1998

Contents
Foreword
Introduction
Clause
1. Scope
2. Normative references
3. Definitions
4. Procedure
    4.1 General
    4.2 Programme definition
    4.3 Establish contact between the two parties
         involved
    4.4 Identify the possible flaws and failure modes
         for each component
    4.5 Select stress types, stress levels and stress
         sequence to be used in order to precipitate failures
    4.6 Determine the duration of the reliability stress
         screening process
    4.7 Mathematically analyze initial test results
    4.8 Perform failure analysis
    4.9 Perform stress sequence on the components
    4.10 Determine approval or rejection criteria
    4.11 Develop closed-loop corrective action process
    4.12 Provide feedback to the component manufacturers
    4.13 Discontinue the reliability stress screening process
Figure 1 - Component reliability screening process (general flow
chart)
Figure 2 - Corrective action process
Annex A (informative) Examples of tools for identifying failure
mechanisms in electronic components
Annex B (informative) Data analysis
Annex C (informative) Examples of applications of reliability
stress screening processes

Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.

DevelopmentNote
Together with IEC 61163-1, supersedes IEC 60300-3-7. (07/2007) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
69
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
BS IEC 61163-2:1998 Identical
CEI 56-36 : 2000 Identical
PN IEC 61163-2 : 2004 Identical
BIS IS 15444-2 : 2005(R2016) Identical
NEN IEC 61163-2 : 1998 Identical
UNE 200004-2:2003 Identical

I.S. EN 62506:2013 METHODS FOR PRODUCT ACCELERATED TESTING (IEC 62506:2013 (EQV))
IEC 60300-3-7:1999 Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware
EN 62506 : 2013 METHODS FOR PRODUCT ACCELERATED TESTING (IEC 62506:2013)
EN 62429:2008 Reliability growth - Stress testing for early failures in unique complex systems
BS EN 61709:2017 Electric components. Reliability. Reference conditions for failure rates and stress models for conversion
BS EN 62506:2013 Methods for product accelerated testing
PD IEC/TR 62721:2012 Reliability of devices used in fibre optic systems. General and guidance
BS EN 60300-2:2004 Dependability management Guidelines for dependability management
NF EN 62429 : 2008 RELIABILITY GROWTH - STRESS TESTING FOR EARLY FAILURES IN UNIQUE COMPLEX SYSTEMS
09/30184127 DC : 0 BS EN 61709 - ELECTRONIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
BS IEC 60300-3.7 : 1999 DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
15/30310531 DC : 0 BS EN 61709 ED 3.0 - ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
EN 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC TR 62721:2012 Reliability of devices used in fibre optic systems - General and guidance
I.S. EN 60300-2:2004 DEPENDABILITY MANAGEMENT - PART 2: GUIDELINES FOR DEPENDABILITY MANAGEMENT
CEI EN 62429 : 2008 RELIABILITY GROWTH - STRESS TESTING FOR EARLY FAILURES IN UNIQUE COMPLEX SYSTEMS
BS EN 62429:2008 Reliability growth. Stress testing for early failures in unique complex systems
IEC 61709:2017 RLV Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC 61709 : 3.0 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
IEC 62506:2013 Methods for product accelerated testing
CEI EN 62506 : 2014 METHODS FOR PRODUCT ACCELERATED TESTING
CEI EN 60300-3-4 : 2010 DEPENDABILITY MANAGEMENT - PART 3-4: APPLICATION GUIDE - GUIDE TO THE SPECIFICATION OF DEPENDABILITY REQUIREMENTS
CSA ISO/TR 10017 : 2003 : R2013 GUIDANCE ON STATISTICAL TECHNIQUES FOR ISO 9001:2000
I.S. EN 61709:2017 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
S.R. ISO/TR 10017:2003 GUIDANCE ON STATISTICAL TECHNIQUES FOR ISO 9001:2000
UNE-EN 62429:2012 Reliability growth - Stress testing for early failures in unique complex systems
IEC 60300-2:2004 Dependability management - Part 2: Guidelines for dependability management
CSA ISO/TR 10017:2003 GUIDANCE ON STATISTICAL TECHNIQUES FOR ISO 9001:2000
PD ISO/TR 10017:2003 Guidance on statistical techniques for ISO 9001:2000
I.S. EN 62429:2008 RELIABILITY GROWTH - STRESS TESTING FOR EARLY FAILURES IN UNIQUE COMPLEX SYSTEMS
ISO/TR 10017:2003 Guidance on statistical techniques for ISO 9001:2000
CEI 56-44 : 2000 DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
IEC 62429:2007 Reliability growth - Stress testing for early failures in unique complex systems
EN 60300-2:2004 Dependability management - Part 2: Guidelines for dependability management
IEC 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

IEC 61163-1:2006 Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
IEC 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC 60300-1:2014 Dependability management - Part 1: Guidance for management and application
IEC 61709 : 3.0 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
IEC 60300-2:2004 Dependability management - Part 2: Guidelines for dependability management

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