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IEC 62137-1-5:2009

IEC 62137-1-5:2009

Current

Current

The latest, up-to-date edition.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

02-11-2009

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment and materials
  4.1 Test equipment for mechanical shear fatigue testing
  4.2 Test substrate
  4.3 Solder alloy
  4.4 Solder paste
  4.5 Reflow soldering equipment
5 Mounting
6 Test conditions
  6.1 Pre-treatment
  6.2 Test procedures
  6.3 Judging criteria
7 Items to be included in the test report
8 Items to be given in the product specification
Annex A (normative) Mechanical shear fatigue test
        equipment
Annex B (normative) Mechanical shear fatigue test
        procedure
Annex C (informative) Evaluation of mechanical properties
        of a single solder joint by mechanical shear
        fatigue test
Bibliography

IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Committee
TC 91
DevelopmentNote
Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
41
PublisherName
International Electrotechnical Committee
Status
Current

BS EN 62137-3:2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
NF EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
09/30206176 DC : DRAFT JUNE 2009 BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
DD IEC PAS 62137-3 : DRAFT 2008 ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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