IEC TS 62647-2:2012
Current
The latest, up-to-date edition.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
11-29-2012
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirement
Annex A (informative) - Guidance on control levels,
risk assessment, and mitigation evaluation
Annex B (informative) - Technical guide on detection
methods, mitigation methods, and methods
for limiting impact of tin
Annex C (informative) - Tin whisker inspection
Annex D (informative) - Analysis and risk assessment
guidance
Annex E (informative) - Whiskers growing from solder
joint fillets and bulk solder
Bibliography
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