05/30133287 DC : DRAFT MAY 2005

Name: 05/30133287 DC : DRAFT MAY 2005
Brand: BSI

Superseded

IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS

Superseded date

07-31-2007

Published date

11-23-2012

Publisher

British Standards Institution

Committee	EPL/501
DocumentType	Draft
PublisherName	British Standards Institution
Status	Superseded
SupersededBy	BS EN 61190-1-3 : 2007

IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014	Soft solder alloys Chemical compositions and forms

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