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BS EN 61190-1-3 : 2007

BS EN 61190-1-3 : 2007

Current

Current

The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

Amended by

BS EN 61190-1-3:2007+A1:2010

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing
  and packaging
Annex A (informative) - Selection of various alloys and
        fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys tests
Annex C (informative) - Marking method of solder
        designation for mounted board, used in electronic
        equipment
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, power solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.

Committee
EPL/501
DevelopmentNote
Supersedes 98/231750 DC (09/2002) Supersedes 05/30133287 DC. (08/2007) 2007 Edition Re-Issued in March 2011 & incorporates AMD 1 2010. Supersedes 09/30190431 DC. (03/2011)
DocumentType
Standard
Pages
40
PublisherName
British Standards Institution
Status
Current
Supersedes

EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 29454-1:1993 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:1990)
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
ISO 9001:2015 Quality management systems — Requirements
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions

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