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ASTM F 219 : 1996

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps

Available format(s)

Hardcopy , PDF

Superseded date

11-11-2014

Language(s)

English

Published date

12-31-2010

CONTAINED IN VOL. 10.04, 2018 Defines the testing of fine wire, flat or round, approximately 0.010 in. (0.25 mm) and smaller in diameter or thickness, used in electronic devices and lamps.

1.1 These test methods cover the testing of fine wire, flat or round, approximately 0.010 in. (0.25 mm) and smaller in diameter or thickness, used in electronic devices and lamps.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Committee
F 01
DocumentType
Test Method
Pages
3
PublisherName
American Society for Testing and Materials
Status
Superseded
SupersededBy

ASTM F 9 : 1969 : R1986 Specification for Round Wire for Use as Grid Siderods in Electron Tubes (Withdrawn 1991)
ASTM F 72 : 2021 Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
ASTM F 288 : 1996 : R2019 Standard Specification for Tungsten Wire for Electron Devices and Lamps
ASTM F 289 : 1996 : R2019 Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM F 288 : 1996 Standard Specification for Tungsten Wire for Electron Devices and Lamps
ASTM F 487 : 2013 Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
ASTM F 73 : 1996 : R2009 Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
ASTM F 73 : 1996 : R2017 Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
ASTM F 289 : 1996 Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM F 72 : 2017 Standard Specification for Gold Wire for Semiconductor Lead Bonding
ASTM F 73 : 1996 : R2013 Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
ASTM F 288 : 1996 : R2014 Standard Specification for Tungsten Wire for Electron Devices and Lamps
ASTM F 288 : 1996 : R2002 Standard Specification for Tungsten Wire for Electron Devices and Lamps
ASTM F 73 : 1996 : R2002 Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
ASTM F 289 : 1996 : R2002 Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM F 487 : 2013 : R2018 Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
ASTM F 288 : 1996 : R2009 Standard Specification for Tungsten Wire for Electron Devices and Lamps
RR-S-615 Revision C:1969 SPONGES, METAL
ASTM F 289 : 1996 : R2009 Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM F 289 : 1996 : R2014 Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM F 73 : 1996 Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps

ASTM F 289 : 1996 Standard Specification for Molybdenum Wire and Rod for Electronic Applications
ASTM B 63 : 2007 Standard Test Method for Resistivity of Metallically Conducting Resistance and Contact Materials
ASTM D 374 : 1999 Standard Test Methods for Thickness of Solid Electrical Insulation

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