CECC 00802 : 1994

Name: CECC 00802 : 1994
Brand: CECC

Withdrawn

GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING (SMDs) OF ASSESSED QUALITY

Withdrawn date

06-02-2016

Published date

01-12-2013

Publisher

Cenelec Electronic Components Committee

Foreword
Preface
1 Introduction
2 Scope
3 Terminology
4 General requirements
4.1 Content of Specification
4.2 Declaration of process suitability
4.3 Packaging and packaging marking
4.4 Component marking
4.5 Storage
4.6 Component outline
4.7 Mechanical stress
4.8 Ordering information
5 Identification of assembly process conditions
5.1 General
5.2 Placement
5.3 Securing the component on substrate prior to
soldering
5.4 Soldering methods
5.5 Cleaning
5.6 Removal and/or replacement of SMDs
5.7 Special handling conditions
6 Reference conditions
6.1 Process Limits
6.2 Classification
6.3 Reference set of assembly cleaning conditions
7 Tests
7.1 General
7.2 Soldering
7.3 Resistance to mechanical forces
7.4 Resistance to cleaning solvent
Annexes
A Test methods for soldering
B Shear test and substrate bending test

Gives a reference set of process conditions and related test conditions that shall be used when compiling component specifications. Coverage includes component marking, storage, component outline, mechanical stress, ordering information, placement, soldering methods, process limits, and reference set of assembly cleaning conditions.

DocumentType	Standard
PublisherName	Cenelec Electronic Components Committee
Status	Withdrawn

Standards	Relationship
DIN 45803:1996-09	Identical
DIN 45802:1997-03	Identical
DIN 45802:1997-03	Corresponds
BS CECC 00802:1994	Identical
DIN 45803:1996-09	Corresponds
BS CECC 00802:1991	Identical

EN 160100 : 1997	CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
EN 61811-54:2002	Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base
BS EN 160100:1998	Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
BS EN 61811-53:2002	Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 14 mm x 9 mm base
BS EN 61811-55:2002	Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 11 mm x 7,5 mm (max.) base
BS EN 168000:1996	Harmonized system of quality assessment for electronic components. Generic specification: quartz crystal units
BS EN 61811-54:2002	Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 15 mm x 7,5 mm base
BS EN 167000:1993	Harmonized system of quality assessment for electronic components. Generic specification: piezoelectric filters
BS EN 130000:1994	Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors
IEC 61811-53:2002	Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base
IEC 61811-55:2002	Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
IEC 61811-54:2002	Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base
I.S. EN 160100:1998	CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
I.S. EN 61811-54:2002	ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE
I.S. EN 61811-53:2002	ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE
I.S. EN 61811-55:2002	ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE
I.S. EN 116000-3:1998	GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES
EN 61811-55:2002	Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
EN 61811-53:2002	Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base
EN 116000-3 : 1996	GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES