SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2004

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

DevelopmentNote	Supersedes DIN EN 60749. (06/2005)
DocumentType	Standard
Pages	15
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current
Supersedes	DIN EN 60749:2002-09

Standards	Relationship
UNE-EN 60749-25:2004	Identical
BS EN 60749-25:2003	Identical
EN 60749-25:2003	Identical
NF EN 60749-25 : 2003	Identical
SN EN 60749-25 : 2003	Identical
NBN EN 60749-25 : 2004	Identical
IEC 60749-25:2003	Identical
I.S. EN 60749-25:2003	Identical