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SN EN 60749-25 : 2003

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING

Published date

01-12-2013

1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
DIN EN 60749-25:2004-04 Identical
BS EN 60749-25:2003 Identical
UNE-EN 60749-25:2004 Identical
I.S. EN 60749-25:2003 Identical
EN 60749-25:2003 Identical

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