DIN EN 61190-1-2:2014-11
Current
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY (IEC 61190-1-2:2014)
Published date
01-12-2013
| DevelopmentNote |
Supersedes DIN IEC 91-142-CD. (01/2003) Supersedes DIN IEC 61190-1-2. (11/2007)
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| DocumentType |
Standard
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Current
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| Supersedes |
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