PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS; SECTIONAL SPECIFICATION

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-1997

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 General
4 Capability approval and maintenance of capability
approval
5 Test specimens
6 Test sequences
7 Quality assessment
8 Customer Detail Specification (CDS) data
9 Characteristics of printed boards
10 Capability test programme
11 Quality conformance inspection
12 Test specimens
Figures
1 Resin smear at interface
2 Circumferential defects
3 Conductor pattern defects
4 Minimum annular width (W1) of external land
5 Minimum annular width (W2) of internal land
6 Hole break-out
7 Examples of soldered holes
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA Normative references to international publications with
their corresponding European publications

Applies to rigid multilayer printed boards whatever the method of manufacture and forms the basis for agreements between manufacturer and user.

DocumentType	Standard
Pages	31
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
NBN EN 62326-4 : 1997	Identical
EN 62326-4:1997	Identical
I.S. EN 62326-4:1998	Identical
BS EN 62326-4:1997	Identical
NF EN 62326-4 : 1998	Identical
UNE-EN 62326-4:1999	Identical
IEC 62326-4:1996	Identical
SN EN 62326-4 : 1997	Identical