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SN EN 62326-4 : 1997

Current

Current

The latest, up-to-date edition.

PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION

Published date

01-12-2013

1 Scope
2 Normative references
3 General
4 Capability approval and maintenance of capability
    approval
5 Test specimens
6 Test sequences
7 Quality assessment
8 Customer Detail Specification (CDS) data
9 Characteristics of printed boards
10 Capability test programme
11 Quality conformance inspection
12 Test specimens
Figures
1 Resin smear at interface
2 Circumferential defects
3 Conductor pattern defects
4 Minimum annular width (W1) of external land
5 Minimum annular width (W2) of internal land
6 Hole break-out
7 Examples of soldered holes
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA Normative references to international publications with
    their corresponding European publications

Applies to rigid multilayer printed boards whatever the method of manufacture and forms the basis for agreements between manufacturer and user.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
DIN EN 62326-4:1997-08 Identical
UNE-EN 62326-4:1999 Identical
I.S. EN 62326-4:1998 Identical
IEC 62326-4:1996 Identical
BS EN 62326-4:1997 Identical
EN 62326-4:1997 Identical

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