ECMA 272 : 2ED 99

Section 1 - General
1 Scope
2 Conformance
   2.1 Optical Disk
   2.2 Generating system
   2.3 Receiving system
3 Reference
4 Definitions
   4.1 Case
   4.2 Channel bit
   4.3 Digital Sum Value (DSV)
   4.4 Disk Reference Plane
   4.5 Dummy substrate
   4.6 Embossed mark
   4.7 Entrance surface
   4.8 Land and Groove
   4.9 Mark
   4.10 Phase change
   4.11 Polarization
   4.12 Recording layer
   4.13 Sector
   4.14 Space
   4.15 Substrate
   4.16 Track
   4.17 Track pitch
   4.18 ZCLV
   4.19 Zone
5 Conventions and notations
   5.1 Representation of numbers
   5.2 Names
6 List of acronyms
7 General description of the optical disk
8 General requirements
   8.1 Environments
        8.1.1 Test environment
        8.1.2 Operating environment
        8.1.3 Storage environment
        8.1.4 Transportation
   8.2 Safety requirement
   8.3 Flammability
9 Reference Drive
   9.1 Optical Head
   9.2 Read channels
   9.3 Rotation speed
   9.4 Disk clamping
   9.5 Normalized servo transfer function
   9.6 Reference Servo for axial tracking
   9.7 Reference Servo for radial tracking
Section 2 - Dimensional, mechanical and physical
            characteristics of the disk
10 Dimensional characteristics
   10.1 Overall dimensions
   10.2 First transition area
   10.3 Second transition area
   10.4 Clamping Zone
   10.5 Third transition area
   10.6 Rim area
   10.7 Remark on tolerances
   10.8 Label
11 Mechanical characteristics
   11.1 Mass
   11.2 Moment of inertia
   11.3 Dynamic imbalance
   11.4 Sense of rotation
   11.5 Runout
        11.5.1 Axial runout
        11.5.2 Radial runout
12 Optical characteristics
   12.1 Index of refraction
   12.2 Thickness of the transparent substrate
   12.3 Angular deviation
   12.4 Birefringence of the transparent substrate
   12.5 Reflectivity
Section 3 - Format of information
13 Data format
   13.1 Data Frames
        13.1.1 Data ID
        13.1.2 Data ID Error Detection code (IED)
        13.1.3 Reserved bytes (RSV)
        13.1.4 Error Detection Code (EDC)
   13.2 Scrambled Frames
   13.3 ECC Blocks
   13.4 Recording Frames
   13.5 Recording code and NRZI conversion
   13.6 Recorded Data Field
   13.7 DC component suppress Control (DCC)
        13.7.1 DCC for the data in the Rewritable Area
        13.7.2 DCC for the data in the Embossed Area
        13.7.3 PID and PED recording
14 Track format
   14.1 Track shape
   14.3 Track pitch
   14.4 Track layout
   14.5 Rotation speed
   14.6 Radial alignment
   14.7 Sector number
15 Sector format
   15.1 Sector layout
         15.1.1 Sector layout in the Rewritable Area
         15.1.2 Sector layout in the Embossed Area
   15.2 VFO fields
   15.3 Address Mark (AM)
   15.4 Physical ID (PID) fields
   15.5 PID Error Detection code (PED) fields
   15.6 Postamble 1 and Postamble 2 (PA 1, PA 2) fields
   15.7 Mirror field
   15.8 Gap field
   15.9 Guard 1 field
   15.10 Pre-Synchronous code (PS) field
   15.11 Data field
   15.12 Postamble 3 (PA 3) field
   15.13 Guard 2 field
   15.14 Recording polarity randomization
   15.15 Buffer field
16 Format of the Information Zone
   16.1 Division of the Information Zone
   16.2 Lead-in Zone
        16.2.1 Structure of Lead-in Zone
        16.2.2 Initial Zone
        16.2.3 Reference Code Zone
        16.2.4 Buffer Zone 1
        16.2.5 Buffer Zone 2
        16.2.6 Control Data Zone
        16.2.7 Connection Zone
        16.2.8 Guard Track Zones 1 and 2
        16.2.9 Disk Test Zone
        16.2.10 Drive Test Zone
        16.2.11 Reserved Zone
        16.2.12 DMA 1 and DMA 2
   16.3 Data Zone
        16.3.1 Structure of Data Zone and of the Defect
               Management Areas (DMAs)
        16.3.2 Guard Track Zones
        16.3.3 Partitioning
   16.4 Lead-out Zone
        16.4.1 Structure of Lead-out Zone
        16.4.2 DMA 3 and DMA 4
        16.4.3 Reserved Zone
        16.4.4 Guard Track Zone 1
        16.4.5 Drive Test Zone
        16.4.6 Disk Test Zone
        16.4.7 Guard Track Zone 2
17 Defect management
   17.1 Defect Management Areas (DMAs)
   17.2 Disk Definition Structure (DDS)
   17.3 Spare sectors
   17.4 Slipping Algorithm
   17.5 Linear Replacement Algorithm
   17.6 Primary Defect List (PDL)
   17.7 Secondary Defect List (SDL)
   17.8 Formatting of the disk
         17.8.1 Full and Partial Certification
         17.8.2 Initialization
         17.8.3 Re-initialization
         17.8.4 Data field number resulting from Initialization
                and Re-initialization
   17.9 Write procedure
   17.10 Read procedure
         17.10.1 Blank ECC block
         17.10.2 Read procedure
Section 4 - Characteristics of embossed information
18 Method of testing
   18.1 Environment
   18.2 Reference Drive
        18.2.1 Optics and mechanics
        18.2.2 Read power
        18.2.3 Read channels
        18.2.4 Tracking channel
        18.2.5 Tracking
   18.3 Definition of signals
19 Signals from lands and grooves
   19.1 Push-pull signal
   19.2 Divided push-pull signal
   19.3 On-track signal
   19.4 Phase depth
   19.5 Wobble signal
20 Signals from Header fields
   20.1 VFO 1 and VFO 2
   20.2 Address Mark, PID, PED and Postamble
   20.3 Signals from Header 1, Header 2, Header 3 and
        Header 4
   20.4 Phase depth
21 Signals from Embossed Area
   21.1 High Frequency (HF) signal
        21.1.1 Modulated amplitude
        21.1.2 Signal asymmetry
        21.1.3 Cross-track signal
   21.2 Jitter
   21.3 Servo signal
        21.3.1 Differential phase tracking error signal
        21.3.2 Tangential push-pull signal
Section 5 - Characteristics of the recording layer
22 Method of testing
   22.1 Environment
   22.2 Reference Drive
        22.2.1 Optics and mechanics
        22.2.2 Read power
        22.2.3 Read channel
        22.2.4 Tracking
   22.3 Write conditions
        22.3.1 Write pulse
        22.3.2 Write power
   22.4 Definition of signals
23 Write characteristics
   23.1 Modulated amplitude and Signal asymmetry
   23.2 Jitter
Section 6 - Characteristics of user data
24 Method of testing
Annex A - Measurement of the angular deviation alpha
Annex B - Measurement of birefringence
Annex C - Measurement of the differential phase tracking
          error
Annex D - Reflectivity calibration and measuring method
Annex E - Tapered cone for disk clamping
Annex F - Measuring conditions for the operation signals
Annex G - 8-to-16 Recording code with RLL (2,10) requirements
Annex H - Definition of the write pulse
Annex J - Guideline for randomization of the Gap length, the
          Guard 1 length and the recording polarity
Annex K - Transportation
Annex L - Guideline for sector replacement