Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Published date

08-05-2011

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: 'Rectangular type' has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.

Committee	CLC/SR 47D
DevelopmentNote	Supersedes UNE EN 60191-6-12. (07/2014)
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current
Supersedes	UNE-EN 60191-6-12:2004

Standards	Relationship
NF EN 60191-6-12 : 2012	Identical
IEC 60191-6-12:2011	Identical
UNE-EN 60191-6-12:2004	Identical
NEN EN IEC 60191-6-12 : 2011	Identical
PN EN 60191-6-12 : 2012	Identical
CEI EN 60191-6-12 : 2012	Identical
I.S. EN 60191-6-12:2011	Identical
UNE-EN 60191-6-12:2011	Identical
DIN EN 60191-6-12:2011-12	Identical
NBN EN 60191 6-12 : 2011	Identical
BS EN 60191-6-12:2011	Identical
BS EN 60793-1-1:2017	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages