MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH LAND GRID ARRAY (FLGA)

Published date

01-12-2013

Publisher

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
Figures
Tables
Annex ZA (normative) Normative references to international
publications with their corresponding European publications

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

DevelopmentNote	Indice de classement: C96-013-6-12. (12/2002) PR NF EN 60191-6-12 February 2011. (03/2011)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
DIN EN 60191-6-12:2011-12	Identical
UNE-EN 60191-6-12:2004	Identical
IEC 60191-6-12:2011	Identical
BS EN 60191-6-12:2011	Identical
I.S. EN 60191-6-12:2011	Identical
EN 60191-6-12:2011	Identical

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NF EN 60191-6-12 : 2012

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH LAND GRID ARRAY (FLGA)

Table of Contents

Abstract

General Product Information

International Equivalents

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