Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Published date

04-15-1999

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
        reference numbers
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

Committee	CLC/SR 91
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
IEC 61249-3-5:1999	Identical
NF EN 61249-3-5 : 2002	Identical
NBN EN 61249 3-5 : 2000	Identical
NEN EN IEC 61249-3-5 : 1999	Identical
I.S. EN 61249-3-5:1999	Identical
UNE-EN 61249-3-5:2000	Identical
PN EN 61249-3-5 : 2002	Identical
SN EN 61249-3-5 : 1999	Identical
BS EN 61249-3-5:1999	Identical
DIN EN 61249-3-5:1999-11	Identical

EN 60249-2-15 : 1994 AMD 1 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY
EN 60249-2-8 : 1994 COR 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM
IEC 60249-2-8:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
EN 60249-1 : 1993 COR 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
EN 60249-2-13 : 1994 AMD 1 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
IEC 60249-2-15:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
IEC 60249-2-13:1987	Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures