SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011)

Published date

09-09-2011

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
        finite element method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.

Committee	SR 47F
DocumentType	Test Method
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
IEC 62047-10:2011	Identical
NBN EN 62047-10 : 2011	Identical
PN EN 62047-10 : 2012	Identical
BS EN 62047-10:2011	Identical
DIN EN 62047-10:2012-03	Identical
NEN EN IEC 62047-10 : 2011	Identical
UNE-EN 62047-10:2011	Identical
CEI EN 62047-10 : 2012	Identical
I.S. EN 62047-10:2011	Identical
NF EN 62047-10 : 2012	Identical

ASTM E 9 : 2009	Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature
IEC 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films