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I.S. EN 60749-37:2008

I.S. EN 60749-37:2008

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2008

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
  4.1 Test apparatus
  4.2 Test components
  4.3 Test board
  4.4 Test board assembly
  4.5 Number of components and sample size
5 Test procedure
  5.1 Test equipment and parameters
  5.2 Pre-test characterization
  5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) Preferred board construction,
        material, design and layout
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
50
PublisherName
National Standards Authority of Ireland
Status
Current
SupersededBy

Standards Relationship
EN 60749-37:2008 Identical
IEC 60749-37:2008 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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Hardcopy - English
PDF - English
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