IEC PAS 62588:2008

1 SCOPE
  1.1 Purpose
2 REFERENCE DOCUMENTS
  2.1 IPC
  2.2 JEDEC
  2.3 IEC
  2.4 European Parliament
  2.5 ANSI
3 TERMS AND DEFINITIONS
  3.1 2D Code Label (Matrix)
  3.2 2 Li (or 2LI)
  3.3 2[nd] Level Interconnect
  3.4 2[nd] Level Interconnect Component Label
  3.5 2[nd] Level Interconnect Terminal Finish or Material
  3.6 Component
  3.7 Base Materials
  3.8 Halogen-Free Board
  3.9 Homogeneous Material
  3.10 intct (or INTCT)
  3.11 Linear Bar Code Label
  3.12 Material Category
  3.13 Maximum Component Temperature
  3.14 'Pb-Free'
  3.15 Pb-Free Symbol
4 SYMBOLS, LABELS AND MARKS
  4.1 Material Category Symbol
       4.1.1 Size and Location
       4.1.2 Color
       4.1.3 Font
  4.2 Pb-Free Symbol
  4.3 2[nd] Level Interconnect Component Label
       4.3.1 Size
       4.3.2 Color
5 MARKING/LABELING CATEGORIES
  5.1 PCB Base Material Categories
       5.1.1 Halogen-Free Base Material
  5.2 PCB Surface Finish Categories
       5.2.1 Pb-Containing
       5.2.2 Pb-Free
  5.3 2[nd] Level Interconnect Categories
       5.3.1 Pb-Containing
       5.3.2 Pb-Free
  5.4 Conformal Coating Categories
6 COMPONENT MARKING AND LABELING
  6.1 Component Marking
  6.2 Lowest Level Shipping Container Labeling
7 PCB/ASSEMBLY MARKING AND LABELING
  7.1 PCB Marking
       7.1.1 PCB Shipping Container Labeling
  7.2 Assembly Marking
       7.2.1 Assembly Shipping Container Labeling
  7.3 Solder Category Marking Sequence
  7.4 Location
  7.5 Size
  7.6 Color
  7.7 Font
  7.8 Method
  7.9 Marking Sequence
  7.10 Re-Marking Changes in PCBA Materials
8 MARKING AND/OR LABELING OF LEAD (Pb)-CONTAINING COMPONENTS,
  8.1 Marking and Labeling of Components
  8.2 Marking and Labeling of PCBs
  8.3 Marking and Labeling of PCB Assemblies
9 SUMMARY OF MARKING AND LABELING REQUIREMENTS
Annex A - Acknowledgment