Customer Support: +1 416-401-8730

Login to i2i Subscription Intertek.com
  • There are no items in your cart
Please enter a keyword to search
Advanced search
Home
IPC
IPC 2315 : 0

IPC 2315 : 0

Current

Current

The latest, up-to-date edition.

DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS

Published date

06-01-2000

Publisher

Institute of Printed Circuits

Published jointly with the Japan Printed Circuit Association, this document gives an easy to follow tutorial on the selection of HDI and microvia design structures and rules.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Learn more on subscription solutions

or

Get in touch with us