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IPC 7092 : 2015

Current

Current

The latest, up-to-date edition.

DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS

Available format(s)

Hardcopy

Language(s)

English

Published date

02-17-2015

This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board.

DocumentType
Standard
Pages
137
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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US$298.20
Excluding Tax where applicable

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