IPC 7092 : 0

Superseded

View Superseded by

DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS

Available format(s)

Hardcopy

Superseded date

01-28-2018

Language(s)

English

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL DESCRIPTION
4 COMPONENT CONSIDERATIONS
5 MATERIALS
6 EMBEDDED COMPONENT PROCESS
   CHARACTERISTICS
7 MOUNTING BASE OR BOARD STACKUP
   CONSIDERATIONS
8 DESIGN METHODOLOGY
9 TESTING AND VERIFICATION
10 POST ASSEMBLY CHARACTERISTICS
11 SUPPLIER SELECTIONS
APPENDIX A - Embedded Component History
APPENDIX B - Embedded Component Test
             Coupons

Specifies the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board.

DevelopmentNote	Included in IPC C 103 & IPC C 1000. (05/2016) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	148
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 7092 : 2015

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
ISO/IEC 17025:2005	General requirements for the competence of testing and calibration laboratories
IPC D 356 : B	BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT
IPC SM 784 : 0	GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION
IPC 4761 : 0	DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
IPC 9252 : A	REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4563 : 0	RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE
IPC TM 650 : 0	TEST METHODS MANUAL
IPC 4811 : 0	SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC 9151 : D	PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
GEIA STD 0005-2 : 2012	MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
IEC 61000-4-2:2008	Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test
IPC 7094 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS
IPC 4821 : 0	SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC QL 653 : A	Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC 2581 : B	GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
ASME Y14.100 : 2017	ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
IPC 9191 : 0	GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC SM 785 : 0	GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
IPC 2316 : 0	DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS