• There are no items in your cart

IPC 4821 : 0

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS

Published date

05-01-2006

1 SCOPE
  1.1 General
  1.2 Designation System
       1.2.1 Embedded Capacitor Passive Device
              Designations
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 American Society for Testing and Materials
       (ASTM)
  2.3 Underwriters Laboratories (UL)
  2.4 National Conference of Standards Laboratories
       (NCSL)
  2.5 International Organization for Standardization
  2.6 International Electrotechnical Commission
3 REQUIREMENTS
  3.1 Terms and Definitions
       3.1.1 Embedded Planar Capacitor
       3.1.2 Embedded Discrete Capacitor
  3.2 Specification Sheets
  3.3 Supplier's Quality Profile
  3.4 Qualification (Characterization) Testing
       3.4.1 Material Qualification
  3.5 Conformance Testing
       3.5.1 Samples
       3.5.2 Frequency
  3.6 Verification of Supplier's Quality System
  3.7 Conflict
  3.8 Materials
       3.8.1 Capacitor Materials in Laminate-Like Form
       3.8.2 Capacitor Materials in Nonlaminate-Like
              Form
       3.8.3 Encapsulant Materials in Nonlaminate-Like
              Form
       3.8.4 Conductor/Termination Materials
  3.9 General Acceptability
       3.9.1 General Acceptability of Dielectric Materials
       3.9.2 General Acceptability of Conductive Materials
       3.9.3 Inspection
  3.10 Visual Requirements
       3.10.1 Visual Requirements of Laminate-Like
              Capacitor Materials
       3.10.2 Visual Requirements of Nonlaminate-Like
              Capacitor Materials
  3.11 Dimensional Requirements
       3.11.1 Dimensional Requirements of Laminate-Like
              Capacitor Materials
  3.12 Mechanical Requirements
       3.12.1 Mechanical Requirements of Laminate-Like
              Capacitor Materials
       3.12.2 Mechanical Requirements of Nonlaminate-Like
              Capacitor Materials
  3.13 Thermal Requirements
       3.13.1 Thermal Requirements of Laminate-Like
              Capacitor Materials
       3.13.2 Thermal Requirements of Nonlaminate-Like
              Capacitor Materials
  3.14 Electrical Requirements
       3.14.1 Electrical Requirements of Laminate-Like
              Capacitor Materials Capacitance (TCC)
       3.14.2 Electrical Requirements of Nonlaminate-Like
              Capacitor Materials
  3.15 Environmental Requirements
       3.15.1 Environmental Requirements of Laminate-Like
              Capacitor Materials
       3.15.2 Environmental Requirements of Nonlaminate-like
              Capacitor Materials
  3.16 Workmanship
  3.17 Material Safety Data Sheets
  3.18 Shelf Life
  3.19 Marking
4 QUALITY ASSURANCE PROVISIONS
  4.1 Quality System
  4.2 Responsibility for Inspection
       4.2.1 Test Equipment and Inspection Facilities
       4.2.2 Standard Laboratory Conditions
  4.3 Qualification (Characterization) Testing
       4.3.1 Samples
       4.3.2 Structurally Similar Construction
       4.3.3 Laboratory Equipment Tolerances
  4.4 Quality Conformance Inspection
       4.4.1 Frequency
       4.4.2 Inspection of Product for Delivery
       4.4.3 Acceptance Criteria
       4.4.4 Rejected Lots
  4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
  5.1 Packing
6 NOTES
  6.1 Ordering Data
  6.2 Electrostatic Discharge (ESD) Testing
  6.3 HiPot Test Method
Figures
Tables

Describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. Also provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials.

Committee
D-52
DevelopmentNote
Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC 2316 : 0 DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD

IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC M 107 : LATEST STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.