IPC 6012 POLISH : C

Superseded

View Superseded by

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

09-14-2023

Language(s)

Polish

Publisher

Institute of Printed Circuits

DocumentType	Standard
Pages	72
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 6012 POLISH : -

IPC J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 4552 : 0	PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS
IPC 6011 : 0	GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC 4553 : A	SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 4202 : A	FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
IPC 9252 : A	REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC JP002 : 0	JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC D 325 : A	DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC 4203 : A	COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
IPC 4563 : 0	RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE
ASME B46.1 : 2009	SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY)
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0	TEST METHODS MANUAL
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC HDBK 001 : E	HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC 4811 : 0	SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2251 : 0	DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
IPC 9151 : D	PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
ASTM B 679 : 1998	Standard Specification for Electrodeposited Coatings of Palladium for Engineering Use
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 9691 : A	USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IPC 4821 : 0	SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
SAE AMS QQ A 250 B : 2012	ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR
IPC 7711/21 : B	REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC QL 653 : A	Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IPC 4781 : 0	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK
NEMA LI 1 : 1998(R2011)	INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC DD 135 : 0	QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
IPC 4554 : 0	SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IPC CF 152 : B	COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC A 47 : 1996	COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL
IPC 6016 : 0	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS
QQ-S-635 Revision B:1976	STEEL PLATE, CARBON
IPC 4103 : A	SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS