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IPC 4554 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS

Available format(s)

Hardcopy

Superseded date

06-04-2022

Language(s)

English

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
APPENDIX 1 - Chemical Process Definitions
APPENDIX 2 - Typical Process Sequence
APPENDIX 3 - Qualification of ISn Process by the Board Supplier
APPENDIX 4 - XRF Measurement Techniques
APPENDIX 5 - Auger/XPS and Coulometric Stripping Techniques
APPENDIX 6 - Tin Whiskers
APPENDIX 7 - Solder Spread Test Protocol
APPENDIX 8 - Standard Development Efforts for IPC-4554,
             Specification for Immersion Tin Plating for
             Printed Circuit Boards

Specifies the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards.

Committee
4-10
DevelopmentNote
Included in IPC C 105 & IPC C 1000. (07/2009) 2007 Edition is available in German Language, see IPC 4554 GERMAN. 2007 Edition Re-Issued in January 2012 & incorporates AMD 1 2012. (02/2012) Also available in Chinese Language, see IPC 4554 CHINESE. (04/2015)
DocumentType
Standard
Pages
56
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

12/30262263 DC : 0 BS IEC 62483 - ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHES
IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 1601 GERMAN : - PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

GR 1217 CORE : ISSUE 2 GENERIC REQUIREMENTS FOR SEPARABLE ELECTRICAL CONNECTORS USED IN TELECOMMUNICATIONS HARDWARE
IPC 6018 : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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