IPC 2251 : 0
Current
The latest, up-to-date edition.
DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
11-01-2003
1 General
1.1 Purpose
1.2 Scope
1.3 Symbology, Terms and Definitions
1.4 Units
2 Applicable Documents
3 Overview
3.1 Decision Making Process
3.2 Design Options
3.3 Mechanical Requirements
3.4 Electrical Considerations
4 Mechanical Considerations
4.1 Printed Board
4.2 Component Materials
4.3 Thermal Considerations
4.4 Component Placement
5 Electrical Considerations
5.1 Power Distribution
5.2 Permittivity
5.3 Lumped Capacitance Versus Transmission Line Environment
5.4 Propagation Delay Time
5.5 Impedance Models
5.6 Loading Effects
5.7 Crosstalk
5.8 Signal Attenuation
5.9 Computer Simulation Program
5.10 Connectors
5.11 EMI Layout Considerations
6 Performance Testing
6.1 Impedance Testing
6.2 Impedance Test Structures and Test Coupons
6.3 Stripline Impedance Test Coupon
Appendix A
Appendix B
Appendix C
Appendix D
Figures
Tables
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