|
IPC A 600 : H
|
ACCEPTABILITY OF PRINTED BOARDS
|
|
IPC T 50 : M
|
TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
|
|
SAE AMS 2424 : 2010
|
PLATING, NICKEL LOW-STRESSED DEPOSIT
|
|
IPC 4552 : 0
|
PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS
|
|
IPC 6011 : 0
|
GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
|
|
IPC 4553 : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
|
|
IPC 4202 : A
|
FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
|
|
IPC 4761 : 0
|
DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
|
|
IPC 9252 : A
|
REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
|
|
IPC D 325 : A
|
DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
|
|
IPC 4203 : A
|
COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
|
|
IPC 4563 : 0
|
RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE
|
|
ASME B46.1 : 2009
|
SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY)
|
|
IPC J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
|
|
IPC TM 650 : 0
|
TEST METHODS MANUAL
|
|
IPC SM 840 : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
|
|
IPC 4811 : 0
|
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
|
|
IPC 2251 : 0
|
DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
|
|
IPC 4101 : D
|
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
|
|
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
|
IPC 9691 : A
|
USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
|
|
SAE AMS QQ A 250 B : 2012
|
ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR
|
|
IPC 7711/21 : B
|
REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
|
|
IPC QL 653 : A
|
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
|
|
IPC 4204 : A
|
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
|
|
IPC 4781 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK
|
|
NEMA LI 1 : 1998(R2011)
|
INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
|
|
IPC 4562 : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS
|
|
IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS
|
|
IPC DD 135 : 0
|
QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
|
|
IPC CF 152 : B
|
COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
|
|
IPC 2223 : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
|
|
IPC 4103 : A
|
SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
|
