IPC-7095D:2018
Current
Current
The latest, up-to-date edition.
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Amended by
Available format(s)
Hardcopy
Published date
02-22-2019
Publisher
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages
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