IPC-7095D-WAM1:2018/AMD 1:2019
Current
Current
The latest, up-to-date edition.
Design and Assembly Process Implementation for BGAs, with Amendment 1
Amendment of
Available format(s)
Hardcopy
Language(s)
English - Chinese, Japanese
Published date
06-01-2019
Publisher
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
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